Published in Development Board

Renesas EK-RA4W1 Evaluation Kit for RA4W1 MCU Group

on21 September 2020 17135 times
The EK-RA4W1 evaluation kit enables users to effortlessly evaluate the features of the RA4W1 MCU Group and develop embedded systems applications using Renesas' Flexible Software Package (FSP)and various IDEs.

Key Features

MCU Native Pin Access

  • R7FA4W1AD2CNG MCU
  • 48MHz, Arm Cortex®-M4 core
  • 512kB Code Flash, 96kB SRAM
  • 56 pins, QFN package
  • MCU headers: 28 pins x2
  • MCU current measurement points

Ecosystem & System Control Access

  • USB Full Speed device
  • 5V input through USB debug
  • Debug on-board (Segger J-Link®)
  • One Digilent PmodTM (SPI)
  • User LED
  • Mechanical user button
  • MCU boot configuration jumper
  • Arduino™ UNO connector

Kit Contents

  • EK-RA4W1 board

Getting Started

Running the Quick Start Example Project

  1. Power up the EK-RA4W1 board through the USB debug port (J11) using the micro USB device cable connected to a 5V power source. The green power LED will light up.
  2. The Quick Start example project will begin to execute blinking the red user LED.
  3. Refer to the attached EK-RA4W1 Quick Start Guide (bin file are included) to explore additional functionality of the Quick Start example project.

Developing Embedded Applications

  1. Modifying the Quick Start example project – Refer to the EK-RA4W1 Quick Start Guide for instructions on importing, modifying and building the Quick Start example project.
  2. Start with one of the many other example projects – Choose from many example projects to learn about different peripherals of the RA4W1 MCU group. These example projects can serve as an excellent starting points for you to develop your custom applications.

Building Custom Hardware

  1. Start by building a functional prototype - Utilize the EK-RA4W1 board with your choice of ecosystem add-ons.
  2. Build custom hardware – Develop custom hardware by referring to the design and manufacturing information provided in the EK-RA4W1 design package.
Last modified on 21 September 2020